Chashak Tulsyan, a sophomore in mechanical engineering, is one of eleven University of Illinois undergraduates offered federally funded Gilman Scholarships to study abroad during the fall and academic year 2012-13, placing Illinois among the top 10 institutions nationally this year in number of recipients.
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Chashak Tulsyan, a sophomore in mechanical engineering, is one of eleven University of Illinois undergraduates offered federally funded Gilman Scholarships to study abroad during the fall and academic year 2012-13, placing Illinois among the top 10 institutions nationally this year in number of recipients.
The scholarship provides financially disadvantaged students eligible for federal Pell Grants with scholarships of up to $5,000 to study abroad. Illinois recipients were among the 1,200 awardees nationally. Tulsyan, who hails from Pune, India, will participate in the Engineering at National University of Singapore program in Singapore during fall 2012.
U. of I. recipients range from sophomores to seniors and come from the colleges of Business, Engineering, Fine and Applied Arts, and Liberal Arts and Sciences. Cumulatively, they will use nearly $50,000 to study on four continents.
The Gilman Scholarship Program aims to diversify the pool of students who study abroad and the countries and regions to which they go. The program is sponsored by the U.S. Department of State Bureau of Educational and Cultural Affairs and administered by the Institute of International Education.
At Illinois, the administration of the scholarship program is shared by the Office of Student Financial Aid, which advertises the award; campus study abroad offices that certify applications; and the National and International Scholarships Program, which offers reviews of student materials and provides feedback to Illinois applicants. Applications for spring 2013 Gilman study abroad scholarships are due by Oct. 2.
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Writer: Madeline Ley, News Bureau intern, 217/333-1085.
If you have any questions about the College of Engineering, or other story ideas, contact Rick Kubetz, editor, Engineering Communications Office, University of Illinois at Urbana-Champaign, 217/244-7716.