Distinguished Alumnus Mark Bohr explains new 3-D transistors in Intel video

Engineering at Illinois alumnus Mark Bohr (BS, 1976, Industrial Engineering, MS, 1978, Electrical Engineering) , and a senior fellow at Intel Corporation, is the star of his own show--a video, rather, that explains the company's new 22 nanometer 3-D transistor. 

To help illustrate the size and operation of 3-D transistors, Bohr "gets small"--about 100nm tall or 20 million times smaller than his actual size--courtesy of a Willie Wonka-like shrink ray and video animation. The significant height adjustment allows Bohr to step up to the 3-D transistor to explain its unique attributes and operation.

After earning his master’s degree at Illinois, Bohr joined Intel Corporation. He later became one of the founding members of Intel’s Portland Technology Development group. Since then, he has been the architect and innovator for every Intel CMOS logic technology for SRAM and microprocessor products since the dawn of high performance CMOS in the early 1980s. He was the early development program manager for Intel’s 45nm microprocessor technology featuring revolutionary high-k + metal gate transistors and, later, directed early development activities for the 22nm generation microprocessor technology.

For more than 25 years, Bohr has shared his innovation and knowledge with the technology community worldwide through many courses inside of Intel, presentations at major IEEE conferences, and numerous publications. His inventions have been documented in 50 patents on integrated circuit processing, and in 2002 he was elected to the position of Intel Senior Fellow, one of only four in the corporation at the time.

He served for many years on the UIUC ECE Alumni Advisory Board and received the ECE Distinguished Alumnus Award in 1998. In 2007, Bohr received the College of Engineering Alumni Award for Distinguished Service "for leadership in the definition, development, and implementation of a highly manufacturable CMOS technology for microprocessor and logic products."
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Writer: Rick Kubetz, Engineering Communications Office, University of Illinois at Urbana-Champaign, 217/244-7716.