Rao R. Tummala
Director, Advaced Packing and Technology Laboratory, IBM Corp., East Fishkill, New York
PhD, Ceramic Engineering, 1968
The career of Rao Tummala, who is an outstanding leader in the field of materials technology, is marked by a steady progression from research in ceramics and glasses to technological application to management of a laboratory that is an acknowledged leader in the technology of packaging of electronic devices. The impact of his contribution has led to greatly enhanced products depending on complex ceramic-metal combinations. These accomplishments are supported by more than 60 inventions and more than 30 patents in the United States and abroad. He has published regularly in scientific journals, and his recently published Microelectronics Packaging Handbook is often cited s the authority on materials technology in microelectronics. Finally, he has remained close to education. He regularly visits many college campuses and has carried on collaborative research with some 20 of them, is an adjunct professor at the Polytechnic University of New York, and often teaches in IBM schools here and abroad. At UIUC, he has monitored research programs in ceramics, metallurgy, mechanical engineering, and theoretical and applied mechanics; was a member of the advisory board of the Department of Ceramic Engineering; and regularly lectures in both ceramic and metallurgy. He is an IBM fellow, has received nine special awards from IBM for patents in materials technology, and is a fellow of the American Ceramic Society.
Current as of 1991.