skip to main content
Seok Kim
Seok Kim
Associate Professor
(217) 265-5656
4414 Mechanical Engineering Lab

For more information

Education

  • BS, Mechanical Engineering, Pohang University of Science and Technology (POSTECH), 2000
  • MS, Mechanical and Aerospace Engineering, UCLA, 2005
  • PhD, Mechanical Engineering, Carnegie Mellon University, 2009

Academic Positions

  • Associate Professor, Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, August 16, 2018-date
  • Assistant Professor, Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, November 1, 2011-August 15, 2018

Professional Registrations

  • President of Korean Graduate Student Association, UCLA, September 2004-December 2004

Research Areas

  • Energy
  • Health and Bio
  • Manufacturing
  • Security and Defense
  • Solid Mechanics and Materials

Selected Articles in Journals

  • Park, J., K. Nan, H. Luan, N. Zheng, S. Zhao, H. Zhang, X. Cheng, H. Wang, K. Li, T. Xie, Y. Huang, Y. Zhang, S. Kim, and J.A. Rogers, “Remotely Triggered Assembly of Three‐dimensional Mesostructures Through Shape Memory Effects,” Advanced Materials, 31, 1905715, 2019
  • Yang, Z., N. Ismail, C. Son, P. Ferreira, and S. Kim, “Broadband, Tunable, Miniaturized Vibration Energy Harvester Using Nonlinear Elastomer Beams and Stretchable Interconnects,” Advanced Materials Technologies, 4, 1900783, 2019
  • Kim, S., "Micro-LEGO for MEMS," MDPI Micromachines, 10. 267, 2019.
  • Park, J. and S. Kim, "Three-Dimensional Structured Flexible Fog Harvesting Surfaces Inspired by Namib Desert Beetles," MDPI Micromachines, 10, 201, 2019.
  • Park, J.K., J. Eisenhaure, and S. Kim, “Reversible underwater dry adhesion of a shape memory polymer,” Advanced Materials Interfaces, 6, 1801542, 2019.
  • Keum, H., Y. Jiang, J.K. Park, J.C. Flanagan, M. Shim, and S. Kim, “Photoresist Contact Patterning of Quantum Dot Films,” ACS Nano, 12, 10024-10031, 2018.
  • Keum, H., J. Park, and S. Kim, “Micro-Lego of 3D SU-8 structures and its application to a re-entrant surface,” Journal of Micro-Bio Robotics, 14, 17-23, 2018.
  • Yang, Z., J. Park, and S. Kim, “Magnetically Responsive Elastomer-Silicon Hybrid Surfaces for Fluid and Light Manipulation,” Small, 14, 1702839, 2018.
  • Yang, Z., R. Potekin, A. Vakakis, and S. Kim, “A Spring-Mass System with Elastomeric Beams and Stretchable Interconnects,” Journal of Micromechanics and Microengineering, 28, 014003, 2018.
  • Eisenhaure, J. and S. Kim, “High-Strain Shape Memory Polymers as Practical Dry Adhesives,” International Journal of Adhesion and Adhesives, 81, 74, 2018.
  • Park, J., Z. Yang, and S. Kim, “Black Silicon/Elastomer Composite Surface with Switchable Wettability and Adhesion between Lotus and Rose Petal Effects by Mechanical Strain,” ACS Applied Materials & Interfaces, 9, 33333, 2017.
  • Park, J. and S. Kim, “Droplet Manipulation on A Structured Shape Memory Polymer Surface,” Lab on a Chip, 17, 1793, 2017.
  • Eisenhaure, J. and S. Kim, “A Review of the State of Dry Adhesives: Biomimetic Structures and the Alternative Designs They Inspire,” MDPI Micromachines, 8, 125, 2017.
  • Yang, Z. and S. Kim, “Positioning Errors in Transfer Printing-Based Microassembly,” Journal of Micro-Bio Robotics, 12, 53, 2017.
  • Keum, H., Y. Jiang, J. Park, J. C. Flanagan, M. Shim, and S. Kim, “Solvent-Free Patterning of Colloidal Quantum Dot Films Utilizing Shape Memory Polymers,” MDPI Micromachines, 8, 18, 2017.
  • Eisenhaure, J. and S. Kim, “Laser-Driven Shape Memory Effect for Transfer Printing Combining Parallelism with Individual Object Control,” Advanced Materials Technologies, 1, 1600098, 2016.
  • Seo, J., J. Eisenhaure, and S. Kim, “Micro-wedge array surface of a shape memory polymer as a reversible dry adhesive,” Extreme Mechanics Letters, 9, 207, 2016.
  • Keum, H., Z. Yang, K. Han, D.E. Handler, T.N. Nguyen, J. Schutt-Aine, G. Bahl, and S. Kim, “Microassembly of Heterogeneous Materials using Transfer Printing and Thermal Processing,” NPG Scientific Report, 6, 29925, 2016.
  • Kim, S., “Lego-Like Microassembly Using Reversible Dry Adhesion,” IEEE Potentials, 35, 4, 2016.
  • Yang, Z., Q. Chen, A.E. Elbanna, and S. Kim, “Transfer printing enabled soft composite films for tunable surface topography,” Extreme Mechanics Letters, 7, 145, 2016.
  • Eisenhaure, J., S.I. Rhee, A.M. Al-okaily, A. Carlson, P.M. Ferreira, and S. Kim, “The Use of Shape Memory Polymers for MEMS Assembly,” IEEE/ASME Journal of Microelectromechanical Systems, 25, 69, 2016.
  • Yang, Z., B. Jeong, A. Vakakis, and S. Kim, “A Tip-Tilt-Piston Micromirror with An Elastomeric Universal Joint Fabricated via Micro-Masonry,” IEEE/ASME Journal of Microelectromechanical Systems Letters, 24, 262 2015.
  • Eisenhaure, J., S.I. Rhee, A.M. Al-okaily, A. Carlson, P.M. Ferreira, and S. Kim, “The Use of Shape Memory Polymers for Microassembly by Transfer Printing,” IEEE/ASME Journal of Microelectromechanical Systems Letters, 23, 1012, 2014.
  • Eisenhaure, J. and S. Kim, “An Internally Heated Shape Memory Polymer Dry Adhesive,” Polymers, 6, 2274, 2014.
  • Keum, H. and S. Kim, “Micro-Masonry for 3D Additive Micromanufacturing,” Journal of Visualized Experiments, 90, e51974, 2014.
  • Zhang, Y., H. Keum, K. Park, R. Bashir, and S. Kim, “Micro-Masonry of MEMS Sensors and Actuators,” IEEE/ASME Journal of Microelectromechanical Systems, 23, 308, 2014.
  • Eisenhaure, J., T. Xie, S. Varghese, and S. Kim, “Microstructured Shape Memory Polymer Surfaces with Reversible Adhesion,” ACS Applied Materials and Interfaces, 5, 7714, 2013.
  • Keum, H., H.-J. Chung, and S. Kim, “Electrical Contact at The Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining,” ACS Applied Materials and Interfaces, 5, 6061, 2013.
  • Keum, H., M. Seong, S. Sinha, and S. Kim, "Electrostatically Driven Collapsible Au Thin Films Assembled Using Transfer Printing for Thermal Switching," Applied Physics Letters, 100, 211904, 2012.
  • Keum, H., A. Carlson, H. Ning, A. Mihi, J.D. Eisenhaure, P.V. Braun, J.A. Rogers, and S. Kim, "Silicon Micro-Masonry Using Elastomeric Stamps for Three-Dimensional Microfabrication," Journal of Micromechanics and Microengineering, 20, 055018, 2012.
  • Kim, S., A. Carlson, H. Cheng, S. Lee, J.-K. Park, Y. Huang, and J.A. Rogers , “Enhanced Adhesion With Pedestal-Shaped Elastomeric Stamps for Transfer Printing,” Applied Physics Letters, 100, 171909, 2012.
  • Kim, S., Y. Su, A. Mihi, S. Lee, Z. Liu, T.K. Bhandakkar, J. Wu, J.B. Geddes III, H.T. Johnson, Y. Zhang, J.-K. Park, P.V. Braun, Y. Huang, and J.A. Rogers, “Imbricate Scales as a Design Construct for Microsystems Technologies,” Small, 8, 901, 2012.
  • Kim, S., J. Wu, A. Carlson, S.H. Jin, A. Kovalsky, P. Glass, Z. Liu, N. Ahmed, S.L. Elgan, W. Chen, P.M. Ferreira, M. Sitti, Y. Huang, and J.A. Rogers, “Microstructured Elastomeric Surfaces with Reversible Adhesion and an Example of Their use in Deterministic Assembly by Transfer Printing,” Proceedings of the National Academy of Sciences of USA, 107, 17095, 2010.
  • Kim, S., M. Sitti, T. Xie, and X. Xia, “Reversible Dry Micro-fibrillar Adhesives with Thermally Controllable Adhesion,” Soft Matter, 5, 3689, 2009.
  • Kim, S., E. Cheung, and M. Sitti, “Wet Self-cleaning of Biologically Inspired Elastomer Mushroom Shaped Microfibrillar Adhesives,” Langmuir, 25, 7196, 2009.
  • Kim, S., B. Aksak, and M. Sitti, “Enhanced Friction of Elastomer Microfiber Adhesives with Spatulate Tips,” Applied Physics Letters, 91, 221913, 2007.
  • Kim, S., M. Sitti, C.-Y. Hui, R. Long, and A. Jagota, “Effect of Backing Layer Thickness on Adhesion of Single-level Elastomer Fiber Arrays,” Applied Physics Letters, 91, 161905, 2007.
  • Kim, S. and M. Sitti, “Biologically Inspired Polymer Microfibers with Spatulate Tips as Repeatable Fibrillar Adhesives,” Applied Physics Letters, 89, 261911, 2006.

Professional Societies

  • Member, Korean-American Scientists and Engineers Association (KSEA)
  • Member, Materials Research Society (MRS)
  • Member, Institute of Electrical and Electronics Engineers (IEEE)
  • Member, American Society of Mechanical Engineers (ASME)

Research Honors

  • KSEA (Korean-American Scientists and Engineers Association) YIG (Young Investigator Grant) Award, 2015
  • ASME Chao and Trigger Young Manufacturing Engineer Award, 2015
  • National Science Foundation CAREER (Faculty Early Career Development) Award, 2014

Courses Taught

  • ME 330 - Engineering Materials
  • ME 371 - Mechanical Design II
  • ME 487 - MEMS-NEMS Theory & Fabrication
  • TAM 251 - Introductory Solid Mechanics